Kostolný, Igor: search on Z-Library

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1

Direct bonding of silicon with solders type Sn-Ag-Ti

Kolenak, Roman, Kostolný, Igor, Sahul, Martin

Journal:

Soldering & Surface Mount Technology

Year:

2016

Language:

english

File:

PDF, 572 KB

english, 2016

2

Investigation of Flux-Less Soldering of Metal Matrix Composite and Ceramics by Use of Zn Solder

Koleňák, Roman, Kostolný, Igor

Journal:

Key Engineering Materials

Year:

2018

Language:

english

File:

PDF, 2.91 MB

english, 2018

3

Research of Fluxless Soldering of High-Purity Aluminium with Solders Type Zn-Al

Koleňák, Roman, Kostolný, Igor, Čička, Roman

Journal:

Advanced Materials Research

Year:

2014

Language:

english

File:

PDF, 1.03 MB

english, 2014

4

Investigation of ultrasound-assisted soldering of SiC ceramics by Zn-Al-In high-temperature solder

Kostolný, Igor, Koleňák, Roman, Hodúlová, Erika, Zacková, Paulína, Kusý, Martin

Journal:

Welding in the World

Year:

2019

Language:

english

File:

PDF, 3.71 MB

english, 2019

5

Wettability of Soldering Alloys at Heating by Electron Beam

Koleňák, Roman, Kostolný, Igor, Dřímal, Daniel, Rabatin, Andrej

Journal:

Materials Science Forum

Year:

2016

Language:

english

File:

PDF, 2.00 MB

english, 2016

6

Research on joining metal-ceramics composite Al/Al 2 O 3 with Cu substrate using solder type Zn–In–Mg

Koleňák, Roman, Kostolný, Igor, Drápala, Jaromír, Drienovský, Marián, Sahul, Martin

Journal:

Journal of Composite Materials

Year:

2019

Language:

english

File:

PDF, 2.77 MB

english, 2019

7

Wettability of Selected Lead-Free Solders for Higher Application Temperatures

Koleňák, Roman, Kostolný, Igor, Šebo, Pavol

Journal:

Key Engineering Materials

Year:

2016

Language:

english

File:

PDF, 850 KB

english, 2016

8

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

Koleňák, Roman, Kostolný, Igor, Drápala, Jaromír, Sahul, Martin, Urminský, Ján

Journal:

Year:

2018

Language:

english

File:

PDF, 9.18 MB

english, 2018

9

Research of Interactions between Al Substrate and Zn-Al Solders

Kostolný, Igor, Koleňák, Roman

Journal:

Procedia Engineering

Year:

2015

Language:

english

File:

PDF, 960 KB

english, 2015

10

Effect of in Addition to Zn-5Al Solder on Microstructure and Properties of Solder Joints

Kostolný, Igor, Koleňák, Roman

Journal:

Key Engineering Materials

Year:

2016

Language:

english

File:

PDF, 1008 KB

english, 2016

11

Characterization of soldering alloy type Zn-In-Mg and the study of direct soldering of silicon and copper

Koleňák, Roman, Kostolný, Igor, Kusý, Martin

Journal:

Materials Science and Engineering: A

Year:

2017

Language:

english

File:

PDF, 1.05 MB

english, 2017

12

Study of Direct Bonding Ceramics with Metal Using Sn2La Solder

Koleňák, Roman, Kostolný, Igor

Journal:

Advances in Materials Science and Engineering

Year:

2015

Language:

english

File:

PDF, 7.16 MB

english, 2015

13

Influence of Alloying Elements in ZnAl5 Based Alloys on Melting Temperature, Tensile Strength and Vickers Hardness

Koleňák, Roman, Kostolný, Igor

Journal:

Applied Mechanics and Materials

Year:

2016

Language:

english

File:

PDF, 1.33 MB

english, 2016

14

Research of Interaction Between Zn Based Solders and Cu, Al Substrates

Prach, Michal, Kostolný, Igor, Koleňák, Roman

Journal:

Research Papers Faculty of Materials Science and Technology Slovak University of Technology

Year:

2014

Language:

english

File:

PDF, 928 KB

english, 2014

15

Effect of in Addition on Microstructure and Properties of Zn-5Al Solder

Koleňák, Roman, Kostolný, Igor

Journal:

Key Engineering Materials

Year:

2017

Language:

english

File:

PDF, 2.17 MB

english, 2017

16

Study of Zn6Al6Ag Alloy Application in Ultrasonic Soldering of Al2O3â(Al/Al2O3) Joints

Kolenak, Roman, Kostolny, Igor, Drapala, Jaromir, Babincova, Paulina, Pasak, Matej

Journal:

Year:

2020

File:

PDF, 8.38 MB

2020

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